Silicon Carbide Advanced Packaging Of Power Semiconductors II

Posted Date: September 07, 2017

Current Closing Date: October 06, 2017

Estimated Total Program Funding $2,500,000


The U.S. Army Contracting Command – Aberdeen Proving Ground, Research Triangle Park Division, on behalf of the U.S. Army Research Laboratory is soliciting proposals under this Special Notice of the BAA for the performance of applied research focused on extending the state-of-the-art in multi-die packaging of semiconductor devices for high-power applications. The aim of this Special Notice under the BAA is to address the current limitations of conventional packaging and support the recent advancements in silicon carbide (SiC) power device technology for military and commercial applications.

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